(UDM)L200C太阳能硅片浓缩切削液

L200C太阳能硅片浓缩切削液,L200C硅片切削液
L200C Cutting Fluid Conc. for Silicon Ingot Bricking/Squaring / Cropping
用于硅锭切块/破方/修整的L200C浓缩切削液
Application: Diamond wire & Band saw processes
用途：金刚石线锯和带锯流程
L200C lubricant Series is a biodegradable water based, non caustic material
L200C系列润滑剂是一种可生物降解、水性、非碱性物质
Dilution ratio of DI /RO water: Cutting Fluid - 500:1  to  800:1
去离子水/反渗透水溶液比例:切削液 - 500:1至800:1
Excellent wetting and rinsing properties 
极好的湿润和冲洗功能
Increases heat transfer (heat dissipation) hence reduces heat buildup and thermal stress
可以加快传热(散热)速度，减少生热和热应力
High speed water surface tension reducer
迅速降低水表面张力
Prevents silicon dust (swarf) agglomeration, allowing for easier cutting
防止硅尘(硅屑)堆积，更加容易切削
浓缩切削液 蓝宝石切削液 晶体切削液 切削液
本产品溶解比例高，在线割过程中带走热量、降低金钢线热量，延长金钢线的使用寿命。